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Datasheet

CY7C1041CV33 Automotive: 4-Mbit (256 K × 16) Static RAM (PDF, 0.60 MB)
Datasheet updated: 02/16/2012

CY7C1041CV33-12BAXE

Development Kit N/A
Automotive Qualified Y
Min. Operating Voltage (V) 3.00
Max. Operating Voltage (V) 3.60
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 125
Frequency (MHz) N/A
Temp. Classification Automotive(E)
Max. Operating VCCQ (V) 3.60
Min. Operating VCCQ (V) 3.00
Speed (ns) 12
Density (Kb) 4096
Organization (X x Y) 256K x 16

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$7.36
$6.75
$6.13
$5.61

Availability
Quantity
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Out of Stock 0 Please click here to check lead times

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package FBGA
No. of Pins 48
Package Dimensions 334 L X 1.2 H X 275 W (Mils)
Package Weight 130.80 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Package Orientation
Standard Pack Quantity 260
Minimum Order Quantity (MOQ) 260
Order Increment 260
Estimated Lead Time (days) 42
HTS Code 8542.32.0040
ECCN 3A991
ECCN Suball (B.2.B.)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Sn/Ag/Cu
Marking Cypress Marking Format
Package Material Declaration
48-FBGA 7X8.5X1.2MM PB-FREE PMDD Last Update: 07/06/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1_48 - FBGA 7X8.5X1.2 MM_ASE Last Update: 07/04/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BK/BP 36, 42, 48, 96) (BW 96,100,119,144,165,172,196,209,256,400) USING MOLD COMPOUND KEG2270, ADHESIVE 2025D, SAC405 - ASE TAIWAN ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
QTP 073205, Automotive 48 Balls FBGA (1.2mm Thickness) and 48 Balls FBGA (6 x 8 x 1mm), SnAgCu, MSL3, 260øC Reflow , ASE-Taiwan.pdf Last Update: 04/25/2012
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

Models (2)
CY7C1041CV33-VHDL Last Update: 15/09/2009
CY7C1041CV33-IBIS Last Update: 15/09/2009
White Papers (1)
SRAM System Design Guidelines Last Update: 10/08/2011