CY7C1021D-10ZSXA
| Automotive Qualified |
Y |
| Min. Operating Voltage (V) |
4.50 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| Frequency (MHz) |
N/A |
| Temp. Classification |
Automotive(A) |
| Max. Operating VCCQ (V) |
5.50 |
| Min. Operating VCCQ (V) |
4.50 |
| Speed (ns) |
10 |
| Density (Kb) |
1024 |
| Organization (X x Y) |
64K x 16 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$3.86 |
$3.54 |
$3.21 |
$2.94 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
TSOP II |
| No. of Pins |
44 |
| Package Dimensions |
729 L X 1.05 H X 435 W (Mils) |
| Package Weight |
453.25 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TRAY
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
135 |
| Minimum Order Quantity (MOQ) |
135 |
| Order Increment |
135 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.32.0040
|
| ECCN |
3A991
|
| ECCN Suball |
(B.2.A.)
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
44L-TSOP II 001-03016
Last Update: 10/25/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_TSOP II 44 (STACK DIE)_ASE
Last Update: 07/05/2012
IPC-1752-2_V1.1_TSOP II 44_CML_GREEN MC
Last Update: 07/04/2012
IPC-1752-2_V1.1_TSOP II 44_PURE SN_OSE
Last Update: 07/04/2012
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RoHS Analysis Certificates (CoA)
TSOP 28 - 001-79768
Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - TSOPII-STACKED DIE (ZW44,54) USING MOLD COMPOUND CEL9200THF, ADHESIVE FH-900, PURE SN - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - TSSOP (ZZ 08,14,16,20,24,28,48,56,64) TSOP (ZY32R, 48) (ZB32) (ZT 28,32,48) (ZD32) TSOPII (ZW32,44) USING MOLD COMPOUND CEL9200HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
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Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Information Notice (PIN) (1)
PIN135200
Last Update: 21/03/2013
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