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CY7C1019CV33-10ZXAT Status: In Production Alert me about changes
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Datasheet

CY7C1019CV33: 1-Mbit (128 K × 8) Static RAM (PDF, 0.45 MB)
Datasheet updated: 06/27/2011

CY7C1019CV33-10ZXAT

Development Kit N/A
Automotive Qualified Y
Min. Operating Voltage (V) 3.00
Max. Operating Voltage (V) 3.60
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 85
Frequency (MHz) N/A
Temp. Classification Automotive(A)
Max. Operating VCCQ (V) 3.60
Min. Operating VCCQ (V) 3.00
Speed (ns) 10
Density (Kb) 1024
Organization (X x Y) 128K x 8

Pricing & Inventory Availability

1-10 unit Price*
11-100 unit Price*
101-1000 unit Price*
1001 + unit Price*
$3.58
$3.28
$2.98
$2.73

Availability
Quantity
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Out of Stock 0 Please click here to check lead times Check Distributors

* Prices are shown in United States dollars and are for budgetary use only.


Packaging/Ordering

Package TSOP II
No. of Pins 32
Package Dimensions 820 L X 1 H X 435 W (Mils)
Package Weight 436.42 (mgs)
Package Cross Section Drawing Download
Package Carrier REEL
Package Carrier Drawing / Orientation Tape Drawing, Reel Drawing, Package Orientation
Standard Pack Quantity 1000
Minimum Order Quantity (MOQ) 1000
Order Increment 1000
Estimated Lead Time (days) 28
HTS Code 8542.32.0040
ECCN 3A991
ECCN Suball (B.2.B.)

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Pure Sn
Marking Cypress Marking Format
Package Material Declaration
32L-TSOP II PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Last Update: 07/05/2012
IPC 1752 Material Declaration
IPC-1752-2_V1.1_TSOP II 32 _NIPDAU_OSE Last Update: 07/03/2012
IPC-1752-2_V1.1_TSOP II 32_PURE SN_OSE Last Update: 07/05/2012
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - TSSOP (ZZ 08,14,16,20,24,28,48,56,64) TSOP (ZY32R, 48) (ZB32) (ZT 28,32,48) (ZD32) TSOPII (ZW32,44) USING MOLD COMPOUND CEL9200HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here.


Technical Documents

White Papers (1)
SRAM System Design Guidelines Last Update: 10/08/2011