CY62128ELL-55SXE
| Development Kit |
N/A
|
| Automotive Qualified |
Y |
| Min. Operating Voltage (V) |
4.50 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
125 |
| Frequency (MHz) |
N/A |
| Temp. Classification |
Automotive(E) |
| Max. Operating VCCQ (V) |
5.50 |
| Min. Operating VCCQ (V) |
4.50 |
| Speed (ns) |
55 |
| Density (Kb) |
1024 |
| Organization (X x Y) |
128K x 8 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$4.85 |
$4.44 |
$4.03 |
$3.70 |
Availability |
Quantity |
Ships In |
Order Now |
| In Stock |
250 |
24-48 hours |
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SOIC |
| No. of Pins |
32 |
| Package Dimensions |
810 L X 0 H X 450 W (Mils) |
| Package Weight |
1340.00 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TUBE
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
125 |
| Minimum Order Quantity (MOQ) |
125 |
| Order Increment |
125 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.32.0040
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au |
| Marking |
Cypress Marking Format |
Package Material Declaration
32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/06/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SOIC 32_450MILS_CML_NIPDAU_GREEN MC
Last Update: 07/04/2012
SOIC 32 - 001-80415
Last Update: 08/29/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ20,24,28,32) SOJ (VZ28,32,36,44) SNC (SY28) SSOP (SP48) USING MOLD COMPOUND KEG6000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ08, 16, 18, 20, 24, 32) SSOP (SP16, 20, 28, 48) USING MOLD COMPOUND G600, ADHESIVE 8290, PURE SN - AMKOR PHILS. ASSEMBLY
Last Update: 07/04/2012
TSOP 28 - 001-79768
Last Update: 06/28/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Package Qualification Report
QTP-111411_001-69459.pdf
Last Update: 07/17/2012
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Change Notice (PCN) (1)
PCN094816
Last Update: 23/07/2010
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Product Information Notice (PIN) (3)
PCN125157
Last Update: 19/06/2012
PCN115049
Last Update: 30/06/2011
PCN104994
Last Update: 19/10/2010
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