CY62128ELL-45ZXAT
| Development Kit |
N/A
|
| Automotive Qualified |
Y |
| Min. Operating Voltage (V) |
4.50 |
| Max. Operating Voltage (V) |
5.50 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
85 |
| Frequency (MHz) |
N/A |
| Temp. Classification |
Automotive(A) |
| Max. Operating VCCQ (V) |
5.50 |
| Min. Operating VCCQ (V) |
4.50 |
| Speed (ns) |
45 |
| Density (Kb) |
1024 |
| Organization (X x Y) |
128K x 8 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$4.15 |
$3.80 |
$3.45 |
$3.16 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
TSOP I |
| No. of Pins |
32 |
| Package Dimensions |
315 L X 1 H X 787 W (Mils) |
| Package Weight |
375.63 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
1500 |
| Minimum Order Quantity (MOQ) |
1500 |
| Order Increment |
1500 |
| Estimated Lead Time (days) |
42 |
| HTS Code |
8542.32.0040
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Pure Sn |
| Marking |
Cypress Marking Format |
Package Material Declaration
32L TSOP I (8X20 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/05/2012
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IPC 1752 Material Declaration
IPC-1752-2_V1.1_TSOP I 32 (8 X 20 MM)_CML
Last Update: 07/03/2012
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RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - TSSOP (ZZ 08,14,16,20,24,28,48,56,64) TSOP (ZY32R, 48) (ZB32) (ZT 28,32,48) (ZD32) TSOPII (ZW32,44) USING MOLD COMPOUND CEL9200HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
Technical Documents
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Product Change Notice (PCN) (1)
PCN071512
Last Update: 17/07/2008
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