CY62126EV30LL-55BVXET
| Development Kit |
N/A
|
| Automotive Qualified |
Y |
| Min. Operating Voltage (V) |
2.20 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
-40 |
| Max. Operating Temp. (°C) |
125 |
| Frequency (MHz) |
N/A |
| Temp. Classification |
Automotive(E) |
| Max. Operating VCCQ (V) |
3.60 |
| Min. Operating VCCQ (V) |
2.20 |
| Speed (ns) |
55 |
| Density (Kb) |
1024 |
| Organization (X x Y) |
64K x 16 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
$4.10 |
$3.76 |
$3.42 |
$3.13 |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
VFBGA |
| No. of Pins |
48 |
| Package Dimensions |
314 L X 1 H X 236 W (Mils) |
| Package Weight |
79.26 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
REEL
|
| Package Carrier Drawing / Orientation |
Tape Drawing, Reel Drawing,
Package Orientation |
| Standard Pack Quantity |
2000 |
| Minimum Order Quantity (MOQ) |
2000 |
| Order Increment |
2000 |
| Estimated Lead Time (days) |
56 |
| HTS Code |
8542.32.0040
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Sn/Ag/Cu |
| Marking |
Cypress Marking Format |
Package Material Declaration
48 - BGA (6X8MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/06/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_BGA 48 (6 X 8 MM) _CML_SNAGCU
Last Update: 07/04/2012
IPC-1752-2_V1.1_BGA 48 (6 X 8 MM) _ASET_SNAGCU(SAC105)
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - BGA (BZ 36,48,52,56,100) USING MOLD COMPOUND KE-G2270, ADHESIVE 2025D, SAC105 - ASE TAIWAN ASSEMBLY
Last Update: 07/04/2012
ROHS ANALYSIS REPORT BGA (BK48A,BK48B,BK48C,BZ36,BZ48A,BZ48B,BZ54C,BZ56,BZ100) USING MOLD COMPOUND KEG2270, ADHESIVE QMI506, SAC105 - CML ASSEMBLY
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
|
Device Qualification Reports
 FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report. Please click here. |
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