CY2303SXCKN
| Automotive Qualified |
N |
| Output Signal Type |
LVCMOS |
| Min. Operating Voltage (V) |
3.00 |
| Max. Operating Voltage (V) |
3.60 |
| Min. Operating Temp. (°C) |
0 |
| Max. Operating Temp. (°C) |
70 |
| Temp. Classification |
Commercial |
| No. of PLL |
1 |
| Input Signal Type |
LVCMOS/LVTTL |
| Input Frequency Max. (MHz) |
41.67 |
| Core Voltage (V) |
3.3 |
| Output Frequency Min. (MHz) |
10 |
| Input Frequency Min. (MHz) |
10 |
| Output Frequency Max. (MHz) |
166.67 |
| Spread Spectrum |
N |
| No. of Outputs |
3 |
| I/O Voltage (V) |
3.3 |
Pricing & Inventory Availability
1-10 unit Price* |
11-100 unit Price* |
101-1000 unit Price* |
1001 + unit Price* |
N/A |
N/A |
N/A |
N/A |
Availability |
Quantity |
Ships In |
Order Now |
| Out of Stock |
0 |
Please click here to check lead times |
Check Distributors
|
* Prices are shown in United States dollars and are for budgetary use only.
Packaging/Ordering
| Package |
SOIC |
| No. of Pins |
8 |
| Package Dimensions |
193 L X 1.46 H X 150 W (Mils) |
| Package Weight |
76.45 (mgs) |
| Package Cross Section Drawing |
Download |
| Package Carrier |
TUBE
|
| Package Carrier Drawing / Orientation |
Drawing,
Package Orientation |
| Standard Pack Quantity |
194 |
| Minimum Order Quantity (MOQ) |
194 |
| Order Increment |
194 |
| Estimated Lead Time (days) |
91 |
| HTS Code |
8542.31.0000
|
| ECCN |
EAR99
|
Quality and RoHS
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Reflow Temp. (°C) |
260 (Cypress Reflow Profile) |
| RoHS Compliant |
Y
Print RoHS Certificate of Compliance
|
| PB Free |
Y |
| Lead/Ball Finish |
Ni/Pd/Au, Pure Sn |
| Marking |
Cypress Marking Format |
Package Material Declaration
8L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: 07/05/2012
|
IPC 1752 Material Declaration
IPC-1752-2_V1.1_SOIC08_AMKOR
Last Update: 07/03/2012
IPC-1752-2_V1.1_SOIC08_CML
Last Update: 07/05/2012
IPC-1752-2_V1.1_SOIC08_OSE
Last Update: 07/04/2012
|
RoHS Analysis Certificates (CoA)
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ08,16,18,20,24) USING MOLD COMPOUND MP8500, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY
Last Update: 07/03/2012
PACKAGE ROHS ANALYSIS REPORT - SOIC (SZ08, 16, 18, 20, 24, 32) SSOP (SP16, 20, 28, 48) USING MOLD COMPOUND G600, ADHESIVE 8290, PURE SN - AMKOR PHILS. ASSEMBLY
Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20,28,48,56) SOIC (SZ08,14,16) USING MOLD COMPOUND CEL9220HF, ADHESIVE 4900G, NIPDAU - OSE TAIWAN ASSEMBLY
Last Update: 07/04/2012
|
Technical Documents
|
|
Product Information Notice (PIN) (1)
PIN135200
Last Update: 21/03/2013
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