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Datasheet

CY14B101LA, CY14B101NA: 1-Mbit (128 K × 8/64 K × 16) nvSRAM (PDF, 0.77 MB)
Datasheet updated: 10/15/2012

CY14B101NA-ZS45XI

Automotive Qualified N
Min. Operating Voltage (V) 2.70
Max. Operating Voltage (V) 3.60
Min. Operating Temp. (°C) -40
Max. Operating Temp. (°C) 85
Frequency (MHz) N/A
Temp. Classification Industrial
Max. Operating VCCQ (V) 3.60
Min. Operating VCCQ (V) 2.70
Speed (ns) 45
Density (Kb) 1024
Organization (X x Y) 64Kb x 16

Pricing & Inventory Availability

1-9
unit Price*
10-24
unit Price*
25-99
unit Price*
100-249
unit Price*
250-999
unit Price*
1000 +
unit Price*
$23.25
$20.63
$19.38
$18.13
$17.13
$16.00

Availability
Quantity
Ships In
Order Now
In Stock 163 24-48 hours

* Prices are shown in United States dollars and are for budgetary use only for volume of 1ku


Packaging/Ordering

Package TSOP
No. of Pins 44
Package Dimensions 729 L X 1.05 H X 435 W (Mils)
Package Weight 453.25 (mgs)
Package Cross Section Drawing Download
Package Carrier TRAY
Package Carrier Drawing / Orientation Drawing, Package Orientation
Standard Pack Quantity 135
Minimum Order Quantity (MOQ) 135
Order Increment 135
Estimated Lead Time (days) 42
HTS Code 8542.32.0040
ECCN EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL) 3
Peak Reflow Temp. (°C) 260 (Cypress Reflow Profile)
RoHS Compliant Y Print RoHS Certificate of Compliance
PB Free Y
Lead/Ball Finish Ni/Pd/Au
Marking Cypress Marking Format
Package Material Declaration
44L - TSOP II PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Last Update: 07/01/2014
IPC 1752 Material Declaration
IPC-1752-2_V1.1_TSOP II 44 (STACK DIE)_ASE Last Update: 07/05/2012
IPC-1752-2_V1.1_TSOP II 44_CML_GREEN MC Last Update: 06/19/2014
IPC-1752-2_V1.1_TSOP II 44_PURE SN_OSE Last Update: 07/04/2012
RoHS Analysis Certificates (CoA)
TSOP 28 - 001-79768 Last Update: 06/28/2012
PACKAGE ROHS ANALYSIS REPORT - TSOPII-STACKED DIE (ZW44,54) USING MOLD COMPOUND CEL9200THF, ADHESIVE FH-900, PURE SN - ASE TAIWAN ASSEMBLY Last Update: 07/04/2012
PACKAGE ROHS ANALYSIS REPORT - TSSOP (ZZ 08,14,16,20,24,28,48,56,64) TSOP (ZY32R, 48) (ZB32) (ZT 28,32,48) (ZD32) TSOPII (ZW32,44) USING MOLD COMPOUND CEL9200HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY Last Update: 07/04/2012
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
001-67416_0F_V.pdf Last Update: 08/01/2014
QTP 110703_001-68009_0A.pdf Last Update: 03/21/2014
QTP 063202_001-85277_00.pdf Last Update: 10/23/2013
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
001-58834_0D_V.pdf Last Update: 01/31/2014


Technical Documents

Models (3)
CY14B101LA_CY14B101NA - Ibis Last Update: 18/08/2010
CY14B101NA, CY14B101MA - Verilog Last Update: 26/07/2010
CY14B101NA_CY14B101MA - VHDL Last Update: 19/04/2010
Product Change Notice (PCN) (5)
PCN125156 Addendum 2 Last Update: 25/07/2014
PCN125156 Addendum Last Update: 25/07/2014
PCN145320 Last Update: 23/06/2014
PCN125156 Last Update: 18/06/2012
PCN115048 Last Update: 19/04/2011
Product Information Notice (PIN) (5)
PIN145277 Last Update: 19/03/2014
PIN145276 Last Update: 19/03/2014
PIN145273 Last Update: 18/03/2014
PCN125157 Last Update: 19/06/2012
PCN104993 Last Update: 19/10/2010



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