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Title
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Customer Rating
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Updated
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PCN115026
Qualification of Minor Mask Revision for On-Die Termination (ODT) Enabled 65nm 72M QDRII+/DDRII+ Products
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Not yet rated
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06/28/11 |
PCN115034
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOJ 32.4 products
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Not yet rated
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03/25/11 |
PCN115025
Release of 36M QDRII/DDRII/QDRII+/DDRII+ Synchronous SRAM Products in 65nm Technology
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Not yet rated
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01/21/11 |
PCN115024
Release of 18M QDRII/DDRII/QDRII+/DDRII+ Synchronous SRAM Products in 65nm Technology
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Not yet rated
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01/21/11 |
PCN115016
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC), China as an additional Wafer Foundry Site for R95 16M MoBLTM Asynchronous SRAM Product Family
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Not yet rated
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01/20/11 |
PCN104997
Notification of Silicon Errata on On-Die Termination (ODT) Enabled 65nm 72M QDRII+/DDRII+ Products
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Not yet rated
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11/10/10 |
PCN104989
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an additional Wafer Fab Site for 32Mb Ultra Low Power SRAM in (0.13um) Process Technology
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Not yet rated
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11/09/10 |
PCN094843
Qualification of 1M/256K nvSRAM families at Cypress Semiconductor Minnesota on a 130nm SONOS Process
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Not yet rated
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09/02/10 |
PCN094842
4Mbit nvSRAM (CY14B104L, CY14B104N) Product Revision
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Not yet rated
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09/02/10 |
PCN071456
Qualification of 2M MoBLTM SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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09/02/10 |
PCN071447
Qualification of 1Mb, 512Kb, and 256Kb Fast Async SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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09/02/10 |
PCN071410
New Revision for Burst of 4 devices QDRII/DDRII 36Mb products
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Not yet rated
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09/02/10 |
PCN071392
Change to 90-nm 18Mb Standard Sync SRAM CY7C138XD 119 BGA Package Devices
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Not yet rated
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09/02/10 |
PCN071503
Prune/EOL/Obsolete List for May 2007
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(4/5) by 1
user
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09/01/10 |
PCN094816
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
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Not yet rated
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07/23/10 |
PCN094796
Qualification of Millenium Microtech Thailand (MMT) as an Assembly Site for PDIP 600mil Pb-free Package
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Not yet rated
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06/08/10 |
PCN094794
Qualification of Millenium Microtech, Thailand (MMT) as an Assembly Site for SOJ 300mil Pb-free Package
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Not yet rated
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06/08/10 |
PCN104935
Qualification of Cypress Philippines as an Additional Assembly Site for 48BGA products
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Not yet rated
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04/22/10 |
PCN094771
Simtek Ceramic Products to be tested at Integra,Wichita,Kansas
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Not yet rated
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03/09/10 |
PCN094780
Qualification of Millenium Microtech Thailand (MMT) as an Assembly Site for SOJ 300mil Package Products
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Not yet rated
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03/24/09 |
PCN084606
Qualification of Xintec Taiwan as new assembly site for 70pin Wafer level chip scale image sensor package with Shellcase Open-Cavity (OC) technology
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Not yet rated
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07/17/08 |
PCN084636
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
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Not yet rated
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07/17/08 |
PCN084643
Datasheet Change to Standard SRAM port Read and Write Cycle timing parameters
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Not yet rated
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07/17/08 |
PCN074597
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
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Not yet rated
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07/17/08 |
PCN074596
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
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Not yet rated
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07/17/08 |
PCN074593
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 119 ball 14x22x2.4mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN074590
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls
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Not yet rated
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07/17/08 |
PCN074585
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 60 ball 8x20x1.2mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN074582
Extension of Last Time Order Entry and Last Time Ship Dates for selected affected MoBLTM and Fast Asynchronous SRAM parts, from previously sent Process Technology
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Not yet rated
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07/17/08 |
PCN071578
Errata for Prune/EOL/Obsolete PCN 071527. Continuing Support for CYD02S36V-167BBC and Replacement Device CY7C09449PVA-AC for Pruned Part CY7C09449PV-AC
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Not yet rated
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07/17/08 |
PCN071577
Correction to PCN#071512: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
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Not yet rated
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07/17/08 |
PCN071568
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 8x9.5mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN071546
Errata for Prune/EOL/Obsolete PCN 071503
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Not yet rated
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07/17/08 |
PCN071544
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
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Not yet rated
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07/17/08 |
PCN071534
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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07/17/08 |
PCN071531
Qualification of KE-G2270/Kyocera Green mold compound and Ablestik 2025D Die Attach for 48FBGA, Pb-Free package assembled at Advanced Semiconductor Engineering (ASE-Taiwan)
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Not yet rated
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07/17/08 |
PCN071530
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
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(3/5) by 1
user
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07/17/08 |
PCN071517
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
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Not yet rated
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07/17/08 |
PCN071516
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165BGA 13x15x1.4mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
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Not yet rated
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07/17/08 |
PCN071512
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
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Not yet rated
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07/17/08 |
PCN071507
Reintroduction of 4M MoBLTM SRAM Devices in 90-nanometer Process Technology in SOIC Packages
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Not yet rated
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07/17/08 |
PCN071418
Qualification of KYOCERA Green Mold Compound for Small Outline Packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071439
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
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Not yet rated
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07/17/08 |
PCN071465
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
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(3/5) by 1
user
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07/17/08 |
PCN084667
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
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Not yet rated
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07/17/08 |
PCN084663
Qualification of Amkor Technology Korea as Assembly Site for 120 lead TQFP Package
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Not yet rated
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07/17/08 |