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Title
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Customer Rating
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Updated
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QTP 112604: 72 MEG / 36MEG QDR EXTREME SYNCHRONOUS SRAM FAMILY, 65NM (LL6XP-18R) TECHNOLOGY, UMC FAB 12A
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Not yet rated
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07/17/12 |
QTP 111816: 56 QFN (8X8X0.9 MILS), 56/68 QFN (8X8X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
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Not yet rated
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07/17/12 |
QTP 105209: AUTOMOTIVE 28L SNC (300 MILS) NIPDAU, MSL3, 235C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 093104: AUTOMOTIVE 32-LEAD STSOP NIPDAU, MSL3, 260C REFLOW CML-R QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 105207: AUTOMOTIVE 28L SOJ (300 MILS) NIPDAU, MSL3, 235C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 105211: AUTOMOTIVE 32L STSOP (8X13.4MM) NIPDAU, MSL3, 260C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 111812: 32 QFN (5X5X1.0 mm) / 40 QFN (6X6X1.0 mm) NiPdAu, MSL3, 260°C Reflow ASEK-Taiwan (G)
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Not yet rated
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07/17/12 |
QTP 094502: 48L SSOP, 300MILS, WITH DOWNBOND, NIPDAU, MSL3, 260C REFLOW, CML-R QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 111411: AUTOMOTIVE 32L SOIC (450 MILS) NIPDAU, MSL3, 260C REFLOW JCETCHINA (JT) QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 103405: 144 Meg QDR/DDR Synchronous SRAM Family, 65nm (LL65P-18R) Technology, UMC Fab 12A
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Not yet rated
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07/17/12 |
QTP 102402: USB 3.0 DEVICE FAMILY, 65NM (LL65H-25ODR) TECHNOLOGY, UMC FAB 12A
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Not yet rated
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07/17/12 |
QTP 090404: AUTOMOTIVE 16-LEAD QFN NIPDAU, MSL3, 260C REFLOW, AMKOR-MB
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Not yet rated
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07/17/12 |
QTP 112111: 1.5GHZ HIGH PERFORMANCE BUFFER DEVICE DERIVATIVE (CY2DL15110), S8TMA-5P, FAB 4 CMI
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Not yet rated
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07/17/12 |
QTP 98244: CY7C026 AND CY7C017 DP SRAM AT FAB-4 CMI USING R42 TECHNOLOGY
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Not yet rated
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07/17/12 |
QTP 112110: CY8CTST242 ON S8DIN TECHNOLOGY IN FAB 4, CMI
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Not yet rated
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07/17/12 |
QTP 104810:48L/56L SSOP (300 MILS), NIPDAU, MSL3 235C REFLOW JCET- CHINA (JT)
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Not yet rated
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07/17/12 |
QTP 110306: CY7C65632/42 AT SSMC PRODUCT QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 104811: 28/32-LEAD SOJ / 28-LEAD SNC (300 MILS) NIPDAU, MSL3 260C REFLOW JCETCHINA (JT)
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Not yet rated
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07/17/12 |
QTP 073905: 172-Ball FBGA (Stacked Die) (15 x 15mm) SnAgCu, MSL3, 260C Reflow ASE-Taiwan (G)
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Not yet rated
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07/17/12 |
QTP 101204: 144 - Ball Grid Array (BGA) (13 x 13 x 1.6mm) MSL3, 220C Solder Reflow ASE-Taiwan (G)
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Not yet rated
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07/17/12 |
QTP 100605: Automotive TrueTouch® Device Family S4AD-5, Fab4
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Not yet rated
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07/17/12 |
QTP 090706: PSoC Device Family
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Not yet rated
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07/17/12 |
QTP 094001: Automotive 32-Lead TSOP II NiPdAu, MSL3, 260C Reflow OSE-Taiwan (T)
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Not yet rated
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07/17/12 |
QTP 092605: Automotive 48-Lead TSOP I NiPdAu, MSL3, 260C Reflow OSE-Taiwan (T)
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Not yet rated
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07/17/12 |
QTP 034402: SRAM Family (7C1320G/7A13206G) R7FD-3R Technology, Fab4, Automotive Application
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Not yet rated
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07/17/12 |
QTP 072002: 2 Meg MoBL SRAM (CY62136/7FV30), R95LD-3R,Fab4, AEC-Q100
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Not yet rated
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07/17/12 |
QTP 103210: Capsense Express Device Family - S8DIN-5R, Fab 5 GSMC
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Not yet rated
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07/17/12 |
QTP 103209: Capsense Express Device Family - S8DI-5R, Fab 4 CMI
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Not yet rated
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07/17/12 |
QTP 101601: 30-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (2.204 X 2.32MM) MSL1, 260C AMKOR-TAIWAN (AU)
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Not yet rated
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07/17/12 |
QTP 100102: Touch Screen PSoC Device Family, S8TMA-5R, Fab4
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Not yet rated
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07/17/12 |
QTP 101901: TRUETOUCH SINGLE TOUCH DEVICE (CY8CTST241) ON S8 (S8DI-5R) TECHNOLOGY IN FAB 5, GSMC QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 112105: 48 QFN (6X6X0.6 mm) / 56 QFN (7X7X0.6 mm) NiPdAu, MSL3, 260°C Reflow ASEK-Taiwan (G)
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Not yet rated
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07/17/12 |
QTP 113902: CAPSENSE EXPRESS DEVICE FAMILY S8DIN-5R, Fab 5 GSMC
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Not yet rated
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07/17/12 |
QTP 114901: Touch Screen PSoC Device Family S8TMC-5R, Fab4
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Not yet rated
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07/17/12 |
QTP 092602: 48-BALL FBGA (2-DIE STACK) (6 X 6 X1.2MM) SNAGCU, MSL3, 260C REFLOW ASE-TAIWAN (G)
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Not yet rated
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07/17/12 |
QTP 031803: 24/32/40/48/56-LEAD QFN PACKAGES, PURE SN, MSL3, 260C REFLOW AMKOR-KOREA (L) QUALIFICATION REPORT
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Not yet rated
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07/17/12 |
QTP 114904: 40 QFN (6X6X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
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Not yet rated
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07/17/12 |
QTP 113903: CAPSENSE EXPRESS DEVICE FAMILY (CY8CMBR2016) ON S8 (S8DI-5R) TECHNOLOGY IN FAB 4, CMI QUALIFICATION REPORT
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Not yet rated
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07/16/12 |
QTP 095301: 32 MEG ASYNCHRONOUS SRAM FAMILY C9FD-3R TECHNOLOGY, FAB4
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Not yet rated
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07/16/12 |
QTP 104609: WIRELESS USB FAMILY (CYRF8935), 0.18UM, TSMC
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Not yet rated
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07/16/12 |
QTP 101208: 48-LEAD SSOP, KEG3000 M/C, NIPDAU, MSL3, 260C REFLOW CML-RA
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Not yet rated
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07/16/12 |
QTP 034503: ALL PLASTIC & THERMALLY ENHANCED QUAD FLATPACKS , PB-FREE, MSL3 260C REFLOW, ASEK-TAIWAN
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Not yet rated
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07/16/12 |
QTP 105202: AUTOMOTIVE 28L TSOP (8X13.4MM) NIPDAU, MSL3, 260C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
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Not yet rated
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07/16/12 |
QTP 104813: 44-LEAD TSOPII NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
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Not yet rated
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07/16/12 |
QTP 112603: 16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN
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Not yet rated
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07/16/12 |
QTP 083204: WEST BRIDGE ASTORIA-SWITCH (7C07101C) AT FAB 5 QUALIFICATION REPORT
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Not yet rated
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07/16/12 |
QTP 033302: 18 MEG SYNCHRONOUS SRAM FAMILY, TECHNOLOGY R9T-3R, FAB4
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Not yet rated
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07/16/12 |
QTP 042402: 32-Lead SOIC, Pb-Free, Ni/Pd/Au Plating, MSL3, 260C Reflow, AEC-Q100 Automotive, CML-R Assembly
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Not yet rated
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07/16/12 |
QTP 114907: 32 QFN (5X5X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
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Not yet rated
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07/16/12 |
QTP 120407: 44 QFN (5X5X0.6MM), NIPDAU, MSL3, 260C REFLOW, ASEK-TAIWAN (G)
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Not yet rated
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07/16/12 |