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Title
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Customer Rating
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Updated
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PCN074585
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 60 ball 8x20x1.2mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN074582
Extension of Last Time Order Entry and Last Time Ship Dates for selected affected MoBLTM and Fast Asynchronous SRAM parts, from previously sent Process Technology
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Not yet rated
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07/17/08 |
PCN071578
Errata for Prune/EOL/Obsolete PCN 071527. Continuing Support for CYD02S36V-167BBC and Replacement Device CY7C09449PVA-AC for Pruned Part CY7C09449PV-AC
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Not yet rated
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07/17/08 |
PCN071577
Correction to PCN#071512: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
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Not yet rated
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07/17/08 |
PCN071568
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 8x9.5mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN071546
Errata for Prune/EOL/Obsolete PCN 071503
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Not yet rated
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07/17/08 |
PCN071544
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
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Not yet rated
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07/17/08 |
PCN071534
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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07/17/08 |
PCN071531
Qualification of KE-G2270/Kyocera Green mold compound and Ablestik 2025D Die Attach for 48FBGA, Pb-Free package assembled at Advanced Semiconductor Engineering (ASE-Taiwan)
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Not yet rated
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07/17/08 |
PCN071530
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
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(3/5) by 1
user
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07/17/08 |
PCN071525
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
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Not yet rated
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07/17/08 |
PCN071521
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071518
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
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Not yet rated
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07/17/08 |
PCN071517
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
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Not yet rated
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07/17/08 |
PCN071516
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165BGA 13x15x1.4mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
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Not yet rated
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07/17/08 |
PCN071514
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
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Not yet rated
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07/17/08 |
PCN071512
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
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Not yet rated
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07/17/08 |
PCN071507
Reintroduction of 4M MoBLTM SRAM Devices in 90-nanometer Process Technology in SOIC Packages
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Not yet rated
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07/17/08 |
PCN071405
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071418
Qualification of KYOCERA Green Mold Compound for Small Outline Packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071439
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
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Not yet rated
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07/17/08 |
PCN071441
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071464
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
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Not yet rated
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07/17/08 |
PCN071465
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
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(3/5) by 1
user
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07/17/08 |
PCN071386
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN084665
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
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Not yet rated
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07/17/08 |
PCN084667
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
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Not yet rated
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07/17/08 |
PCN084663
Qualification of Amkor Technology Korea as Assembly Site for 120 lead TQFP Package
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Not yet rated
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07/17/08 |