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Title
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Customer Rating
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Updated
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PCN125159
Qualification of ASE Taiwan as an additional assembly site for 121 Ball Grid Array (BGA) packaged products
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Not yet rated
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06/18/12 |
PCN125156
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
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Not yet rated
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06/18/12 |
PCN125154
Qualification of Deca Technologies as a Test Site for all Cypress WLCSP products thereby enabling Full Turnkey WLCSP Manufacturing for these products
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Not yet rated
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06/18/12 |
PCN115026
Qualification of Minor Mask Revision for On-Die Termination (ODT) Enabled 65nm 72M QDRII+/DDRII+ Products
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Not yet rated
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06/28/11 |
PCN115059
Errata on PSoC 3 devices
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Not yet rated
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05/23/11 |
PCN115034
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOJ 32.4 products
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Not yet rated
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03/25/11 |
PCN115025
Release of 36M QDRII/DDRII/QDRII+/DDRII+ Synchronous SRAM Products in 65nm Technology
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Not yet rated
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01/21/11 |
PCN115024
Release of 18M QDRII/DDRII/QDRII+/DDRII+ Synchronous SRAM Products in 65nm Technology
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Not yet rated
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01/21/11 |
PCN115020
Addendum to PCN#105011--USB MCU Product Availability-Supply Chain Options [FAQ Document]
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Not yet rated
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01/21/11 |
PCN115019
Qualification of additional manufacturing sites for 49 Balls WLCSP, Pb-Free Packages for select TrueTouch Multi-Touch All-Point products
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Not yet rated
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01/21/11 |
PCN115016
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC), China as an additional Wafer Foundry Site for R95 16M MoBLTM Asynchronous SRAM Product Family
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Not yet rated
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01/20/11 |
PCN115014
Product Obsolescence Notification for select TrueTouch Multi-Touch products.
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Not yet rated
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01/20/11 |
PCN105011
USB MCU products availability - Supply Chain Options
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Not yet rated
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12/20/10 |
PCN104997
Notification of Silicon Errata on On-Die Termination (ODT) Enabled 65nm 72M QDRII+/DDRII+ Products
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Not yet rated
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11/10/10 |
PCN104989
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an additional Wafer Fab Site for 32Mb Ultra Low Power SRAM in (0.13um) Process Technology
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Not yet rated
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11/09/10 |
PCN104988
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an additional Wafer Fabrication site for select TrueTouch Multi-Touch All-Point products
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Not yet rated
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10/19/10 |
PCN094843
Qualification of 1M/256K nvSRAM families at Cypress Semiconductor Minnesota on a 130nm SONOS Process
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Not yet rated
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09/02/10 |
PCN094842
4Mbit nvSRAM (CY14B104L, CY14B104N) Product Revision
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Not yet rated
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09/02/10 |
PCN094778
Qualification of ASE Shanghai as an Assembly Site for Select 40-Lead QFN (6x6x1.0mm) Package Products Using the Saw Singulation Process
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Not yet rated
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09/02/10 |
PCN094753
Qualification of ASE Shanghai as an Assembly Site for the 68 QFN (8x8x1.0 mm) Package Using the Saw Singulation Process
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Not yet rated
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09/02/10 |
PCN084603
Qualification of Advanced Interconnect Technologies Indonesia (AIT) as an assembly site for 56 QFN 8X8X1mm Saw Type Pb-Free package
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Not yet rated
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09/02/10 |
PCN071545
Obsolescence and Replacement of CY3900I CPLD Development Kit
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Not yet rated
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09/02/10 |
PCN071456
Qualification of 2M MoBLTM SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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09/02/10 |
PCN071447
Qualification of 1Mb, 512Kb, and 256Kb Fast Async SRAM Devices in 90-nanometer Process Technology
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Not yet rated
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09/02/10 |
PCN071410
New Revision for Burst of 4 devices QDRII/DDRII 36Mb products
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Not yet rated
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09/02/10 |
PCN071392
Change to 90-nm 18Mb Standard Sync SRAM CY7C138XD 119 BGA Package Devices
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Not yet rated
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09/02/10 |
PCN071503
Prune/EOL/Obsolete List for May 2007
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(4/5) by 1
user
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09/01/10 |
PCN094818
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
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Not yet rated
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08/12/10 |
PCN094816
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
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Not yet rated
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07/23/10 |
PCN094808
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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07/05/10 |
PCN094796
Qualification of Millenium Microtech Thailand (MMT) as an Assembly Site for PDIP 600mil Pb-free Package
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Not yet rated
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06/08/10 |
PCN094794
Qualification of Millenium Microtech, Thailand (MMT) as an Assembly Site for SOJ 300mil Pb-free Package
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Not yet rated
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06/08/10 |
PCN104942
Qualification of Additional Assembly Sites for 40-lead QFN (6X6X1 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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04/22/10 |
PCN104935
Qualification of Cypress Philippines as an Additional Assembly Site for 48BGA products
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Not yet rated
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04/22/10 |
PCN104914
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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04/22/10 |
PCN094771
Simtek Ceramic Products to be tested at Integra,Wichita,Kansas
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Not yet rated
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03/09/10 |
PCN094786
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
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Not yet rated
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04/21/09 |
PCN094780
Qualification of Millenium Microtech Thailand (MMT) as an Assembly Site for SOJ 300mil Package Products
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Not yet rated
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03/24/09 |
PCN094779
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
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Not yet rated
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03/24/09 |
PCN094752
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
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Not yet rated
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02/02/09 |
PCN084606
Qualification of Xintec Taiwan as new assembly site for 70pin Wafer level chip scale image sensor package with Shellcase Open-Cavity (OC) technology
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Not yet rated
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07/17/08 |
PCN084619
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an alternate wafer fab site for West Bridge Antioch Product using C8Q-3R (0.13um) Process Technology
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Not yet rated
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07/17/08 |
PCN084633
Change in Tube Bundling Ship Process
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Not yet rated
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07/17/08 |
PCN084636
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
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Not yet rated
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07/17/08 |
PCN084643
Datasheet Change to Standard SRAM port Read and Write Cycle timing parameters
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Not yet rated
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07/17/08 |
PCN074597
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
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Not yet rated
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07/17/08 |
PCN074596
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
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Not yet rated
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07/17/08 |
PCN074594
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 7X7X1.2mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN074593
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 119 ball 14x22x2.4mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN074590
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls
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Not yet rated
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07/17/08 |