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Title
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Customer Rating
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Updated
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PCN125159
Qualification of ASE Taiwan as an additional assembly site for 121 Ball Grid Array (BGA) packaged products
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Not yet rated
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06/18/12 |
PCN125154
Qualification of Deca Technologies as a Test Site for all Cypress WLCSP products thereby enabling Full Turnkey WLCSP Manufacturing for these products
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Not yet rated
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06/18/12 |
PCN115020
Addendum to PCN#105011--USB MCU Product Availability-Supply Chain Options [FAQ Document]
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Not yet rated
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01/21/11 |
PCN105011
USB MCU products availability - Supply Chain Options
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Not yet rated
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12/20/10 |
PCN094778
Qualification of ASE Shanghai as an Assembly Site for Select 40-Lead QFN (6x6x1.0mm) Package Products Using the Saw Singulation Process
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Not yet rated
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09/02/10 |
PCN084603
Qualification of Advanced Interconnect Technologies Indonesia (AIT) as an assembly site for 56 QFN 8X8X1mm Saw Type Pb-Free package
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Not yet rated
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09/02/10 |
PCN071545
Obsolescence and Replacement of CY3900I CPLD Development Kit
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Not yet rated
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09/02/10 |
PCN094818
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
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Not yet rated
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08/12/10 |
PCN094816
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
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Not yet rated
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07/23/10 |
PCN094808
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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07/05/10 |
PCN104942
Qualification of Additional Assembly Sites for 40-lead QFN (6X6X1 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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04/22/10 |
PCN104914
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process
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Not yet rated
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04/22/10 |
PCN094786
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
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Not yet rated
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04/21/09 |
PCN094779
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
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Not yet rated
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03/24/09 |
PCN084619
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an alternate wafer fab site for West Bridge Antioch Product using C8Q-3R (0.13um) Process Technology
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Not yet rated
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07/17/08 |
PCN084633
Change in Tube Bundling Ship Process
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Not yet rated
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07/17/08 |
PCN074594
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 7X7X1.2mm BGA Packages Using SnAgCu Solder Balls
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Not yet rated
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07/17/08 |
PCN071525
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
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Not yet rated
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07/17/08 |
PCN071521
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071518
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
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Not yet rated
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07/17/08 |
PCN071514
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
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Not yet rated
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07/17/08 |
PCN071512
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
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Not yet rated
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07/17/08 |
PCN071405
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071418
Qualification of KYOCERA Green Mold Compound for Small Outline Packages assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071441
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN071464
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
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Not yet rated
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07/17/08 |
PCN071386
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
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Not yet rated
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07/17/08 |
PCN084665
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
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Not yet rated
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07/17/08 |