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Results 34801 - 34900 of 35140 < Previous  1   2   3   4   5    ...  348   349  350   351   352   Next >
Title Resource Type Related Categories Customer Rating Updated
Fab 4 - HotLink DX Family, R42LHD Technology (CY7C924DX/954DX/CY7C9689)
http://www.cypress.com/?rID=35512
Qualification Reports
Not yet rated
05/07/03
New Technology CMOS2AN, Hynix Fab, Bus Interface Logic Circuit (CY7C964A)
http://www.cypress.com/?rID=35502
Qualification Reports
Not yet rated
05/07/03
TSMC-2A - Low Cost Three-PLL Clock Generator, L28 Technology, (CY2081SC/CY2081SL)
http://www.cypress.com/?rID=35482
Qualification Reports
Not yet rated
05/07/03
CSM Fab 2 - 0.35um technology (CY7B9950/CY2DP818/CY28346/CY299*)
http://www.cypress.com/?rID=36400
Qualification Reports RoboClock™ Skew Management Buffers, Clock Distribution
Not yet rated
04/17/03
100 Lead Thin Quad Flat Pack (14 x 20 x 1.4mm) using Hitachi CEL9200XU Mold Compound, MSL3, CHIPMOS(
http://www.cypress.com/?rID=35633
Qualification Reports
Not yet rated
04/14/03
120Lead TQFP Package, Sumitomo EME7320CR Molding Compound, MSL5, Anam Seoul- Korea
http://www.cypress.com/?rID=35635
Qualification Reports
Not yet rated
04/04/03
CYP25G01100VIA in 456-ball PBGA package, MSL3, ASE Taiwan
http://www.cypress.com/?rID=35507
Qualification Reports
Not yet rated
04/02/03
Fab 4 - 4 Meg Synchronous 3.3V RAM, R52D-3 Technology. (CY7C1350B/CY7C1351B/CY7C1352B/CY7C1353B
http://www.cypress.com/?rID=36364
Qualification Reports
Not yet rated
04/02/03
16-Lead TSSOP, SHINETSU KMC-184-3 MC, MSL1, Signetics-Korea
http://www.cypress.com/?rID=35608
Qualification Reports
Not yet rated
03/21/03
20-Lead (4 x 4) QFN, MSL3, Amkor-Korea
http://www.cypress.com/?rID=35606
Qualification Reports
Not yet rated
03/21/03
56-Lead SSOP, NITTO MP-8500 MC and Ni/Pd Leadframe, MSL3, 260C Reflow, CML
http://www.cypress.com/?rID=35604
Qualification Reports
Not yet rated
03/21/03
CYM52KQT36AV25, 2-Die, 165-ball, FBGA package and Toshiba KE-G1270 M/C, MSL3 @ ASE Taiwn
http://www.cypress.com/?rID=35625
Qualification Reports
Not yet rated
03/01/03
Fab TSMC Packet over SONET/SDH IC-POSIC, 0.18um (T018) TSMC Technology, (CY7C9536/CY7C9536A)
http://www.cypress.com/?rID=35564
Qualification Reports
Not yet rated
03/01/03
120-lead TQFP, MSL3, Anam-Seoul Korea, (SEOL-L)
http://www.cypress.com/?rID=35561
Qualification Reports
Not yet rated
02/01/03
235C Solder Reflow Profile, All Assembly Sites for TSOP Package Family.
http://www.cypress.com/?rID=36373
Qualification Reports
Not yet rated
02/01/03
Fab 4 / TSMC Fab Programmable Serial Interface, B53D-3/0.18um technology (CYP15G04K*)
http://www.cypress.com/?rID=35554
Qualification Reports
Not yet rated
02/01/03
Fab 4 Fast Asynchronous SRAM, Technology Derivative R7FD-3 (CY7C1018CV33/CY7C1019CV33/CY7C1021CV33)
http://www.cypress.com/?rID=35535
Qualification Reports Async Fast SRAMs, Memory, Asynchronous SRAM
Not yet rated
02/01/03
100-ball Thin Ball Grid Array (11x11x1.4mm) FBGA package, MSL3, ASE Taiwan
http://www.cypress.com/?rID=35557
Qualification Reports
Not yet rated
01/01/03
24-lead QSOP package using Hitachi CEl 9200CYR / IV77 M/C & Ni/Pd leadframe at 260CSolder Reflow at
http://www.cypress.com/?rID=35628
Qualification Reports
Not yet rated
01/01/03
48-ball Fine Pitch Ball Grid Array (FBGA), MSL3, GAPT
http://www.cypress.com/?rID=35638
Qualification Reports
Not yet rated
01/01/03
256K Fast Asynchronous SRAM, CY7C1399B R52D-3 In Fab4
http://www.cypress.com/?rID=35511
Qualification Reports Memory, Wafer & Die, Asynchronous SRAM
Not yet rated
12/01/02
Fab 4 - 1 Meg Fast Asynchronous SRAM, R52FD-3 Technology, (CY7C1019BV33/CY7C1021BV33)
http://www.cypress.com/?rID=35473
Qualification Reports Wafer & Die
Not yet rated
12/01/02
Fab 4 - 1Meg Fast Asynchronous RAM, R52D-5R Technology (CY7C1021B/CY7C1019B)
http://www.cypress.com/?rID=35472
Qualification Reports Multi-Protocol PHYs, Asynchronous SRAM
Not yet rated
12/01/02
Fab 4 - 2 Meg FCP MoBL2 SRAM, R52D-3 Technology, (CY62135BV18/CY62136BV18/CY62137BV18)
http://www.cypress.com/?rID=35501
Qualification Reports
Not yet rated
12/01/02
Fab 4 - 256K Fast Asynchronous SRAM, R42HDHA Technology, (CY7C194/CY7C195/CY7C197/CY7C198/CY7C199)
http://www.cypress.com/?rID=35487
Qualification Reports Async Fast SRAMs, Wafer & Die
Not yet rated
12/01/02
Fab 4 - 2Meg FCT MoBL SRAM, 2.7V - 3.6V, R52LD-3 Technology, (CY62135V/CY62136V/CY62137V)
http://www.cypress.com/?rID=35491
Qualification Reports Async Micropower (MoBL™) SRAMs
Not yet rated
12/01/02
Fab 4 - 4 Meg Synchronous 3.3V Cache RAM, R52D-3 Technology, (CY7C1325B/27B/38B/39B/45B/47B)
http://www.cypress.com/?rID=36387
Qualification Reports
Not yet rated
12/01/02
Fab 4 - 4Meg FCT MoBL SRAM, 2.7V - 3.6V, R52LD-3 Technology, (CY62145V/CY62146V/CY62147V)
http://www.cypress.com/?rID=35494
Qualification Reports Wafer & Die
Not yet rated
12/01/02
Fab 4 - 4Meg MoBL2 SRAM, 1.65V - 1.95V, R52D-3 Technology, (CY62146BV18/CY62147BV18)
http://www.cypress.com/?rID=35503
Qualification Reports
Not yet rated
12/01/02
Fab 4 - 4Meg, FCT MoBL2 SRAM, 1.65V - 1.95V, R52FD-3 Technology (CY62145V18/CY62146V18/CY62147V18)
http://www.cypress.com/?rID=35486
Qualification Reports
Not yet rated
12/01/02
Fab 4 - 512K x 8 Static Ram, 4.5V-5.5V, R52LD-5R Technology (CY62148B)
http://www.cypress.com/?rID=35508
Qualification Reports Wafer & Die
Not yet rated
12/01/02
Fab 4 32K x 8 Static RAM, 5V, R42H technology (CY62256)
http://www.cypress.com/?rID=36339
Qualification Reports
Not yet rated
12/01/02
Fab 4, 4 Meg MoBL SRAM, R52LD-3 Technology (CY62146V/CY62147V/CY62148B)
http://www.cypress.com/?rID=35469
Qualification Reports Wafer & Die
Not yet rated
12/01/02
24-lead PDIP package using NITTO MP_8000CH Molding Compound, MSL3, Omedata
http://www.cypress.com/?rID=35607
Qualification Reports
Not yet rated
11/01/02
Fab 4 - 32K x 16 SRAM, R3 Technology Qualification
http://www.cypress.com/?rID=36210
Qualification Reports Wafer & Die
Not yet rated
11/01/02
Fab 4 - 4 Meg Asynchronous RAM, R52D-5R Technology, (CY7C1041B/CY7C1046B/CY7C1049B)
http://www.cypress.com/?rID=35466
Qualification Reports Async Fast SRAMs, Asynchronous SRAM
Not yet rated
11/01/02
Fab 4 1/2 Meg,Fast Async SRAM, R52D-5R (CY7C1020B)
http://www.cypress.com/?rID=35571
Qualification Reports Wafer & Die
Not yet rated
11/01/02
Fab 4 2Meg MoBL & Micropwer SRAM R7LD-3 Technology (CY62135CV-2XWI/CY62136CV*/CY62137CV*/CY62138CV*)
http://www.cypress.com/?rID=35592
Qualification Reports
Not yet rated
11/01/02
Fab 4 512K x 24 Static RAM, R7FD-3 technology (CYM8301BV33)
http://www.cypress.com/?rID=35591
Qualification Reports
Not yet rated
11/01/02
Fab 4 MoBL Async. SRAM, Technology Derivaitive R7LD-3 (CY62155CV/CY62157CV*/CY62158CV*)
http://www.cypress.com/?rID=35538
Qualification Reports Memory
Not yet rated
11/01/02
Fab 4 Quad Data Rate SRAM, R63D-25 Technology (CY7C1302V25/CY7C1304V25)
http://www.cypress.com/?rID=35540
Qualification Reports
Not yet rated
11/01/02
Fab 4 Synchronous SRAM family, R7FT-3R technology (CY1354BV25/CY7C1360B/CY7C1361B/CY7C1366B)
http://www.cypress.com/?rID=35610
Qualification Reports
Not yet rated
11/01/02
Fab 4, MoBL2 Asynchronous SRAM, R7LD-1.8 Technology (CY62135CV18LL/CY62136CV18LL/CY62137CV18LL)
http://www.cypress.com/?rID=35559
Qualification Reports Asynchronous SRAM
Not yet rated
11/01/02
Halogen Free Molding Compound and Pb-free Solder balls, 260C IR Reflow for 48-ball FBGA package, ASE
http://www.cypress.com/?rID=35550
Qualification Reports
Not yet rated
11/01/02
New Technology 0.25umWaferTech, (CY7C1354A/55A/56A/57A/60A/61A/62A/63A/66A/67A)
http://www.cypress.com/?rID=35529
Qualification Reports
Not yet rated
11/01/02
New Technology, R7LD-1.8, Fab 4, MoBL and Micropower-Low Power Async. SRAM (CY62157CV18LL)
http://www.cypress.com/?rID=35544
Qualification Reports Memory
Not yet rated
11/01/02
Sumitomo EME-6600HR Molding Compound, 32-lead SOJ package, MSL 3, Omedata Indonesia
http://www.cypress.com/?rID=35614
Qualification Reports
Not yet rated
11/01/02
TSMC 0.15um Technology, Fab TSMC 18 Meg Sync SRAM (CY7C1370B*/71B*/72B*/80B*/81B*/82B*/83B*86B*/87B*
http://www.cypress.com/?rID=35545
Qualification Reports Memory
Not yet rated
11/01/02
Technology Derivative R7LD-3, Fab 4 MoBL and Micrpower Async SRAM (CY62145CV*/46CV*/47CV*/48CV*)
http://www.cypress.com/?rID=35570
Qualification Reports
Not yet rated
11/01/02
388-ball Heat Slug Ball Grid Array (HSBGA) package, MSL3. ASE Taiwan
http://www.cypress.com/?rID=35621
Qualification Reports
Not yet rated
10/01/02
504-ball Plastic Ball Grid Array (L2BGA), MSL3, ASE Taiwan
http://www.cypress.com/?rID=35566
Qualification Reports
Not yet rated
10/01/02
484-ball Thin Ball Grid Array (FBGA), MSL3, ASE Taiwan
http://www.cypress.com/?rID=35601
Qualification Reports
Not yet rated
09/01/02
New 0.18um technology, TSMC fab Delta 39K ISR CPLD (CY39030V*/CY39050V*/CY39100V*/Z*/CY39200V*/Z*)
http://www.cypress.com/?rID=35562
Qualification Reports
Not yet rated
09/01/02
32-lead Thin Small Outline Package (TSOP), MSL3, OSE Taiwan
http://www.cypress.com/?rID=35582
Qualification Reports
Not yet rated
08/01/02
20-lead TSSOP Package, MSL1, Signetics Korea
http://www.cypress.com/?rID=36398
Qualification Reports
Not yet rated
07/01/02
28.3-lead PDIP package, OSE Philippines
http://www.cypress.com/?rID=35579
Qualification Reports
Not yet rated
07/01/02
165-ball Fine Pitch Ball Grid Array (FBGA), MSL3, ASE Taiwan
http://www.cypress.com/?rID=35580
Qualification Reports
Not yet rated
06/01/02
Fab 4 - 2.7V-3.6V, Slow Low Power Mobl SRAM, R52LD3 Technology, (CY62126BVLL/CY62127BVLL)
http://www.cypress.com/?rID=36376
Qualification Reports
Not yet rated
05/01/02
120-lead TQFP, MSL3, ASE Taiwan
http://www.cypress.com/?rID=35573
Qualification Reports
Not yet rated
04/02/02
24-lead SOICw/die size 89x126mils or less, Nitto MP-8500 M/C and Ni/Pd leadframe, 235C reflow, CML
http://www.cypress.com/?rID=35576
Qualification Reports
Not yet rated
04/02/02
44-lead PLCC Package, OSE Philippines Assembly
http://www.cypress.com/?rID=35560
Qualification Reports
Not yet rated
04/02/02
32-lead Plastic Dual-In-Line Package (PDIP) OSE Philippines
http://www.cypress.com/?rID=35572
Qualification Reports
Not yet rated
03/01/02
Assembly Site OSE Philippines for 28-Lead SOIC Package
http://www.cypress.com/?rID=35552
Qualification Reports
Not yet rated
02/01/02
MSL3 172-Thin Ball Grid Array (FBGA) 15mm x 15mm ASE Taiwan Assembly
http://www.cypress.com/?rID=35513
Qualification Reports
Not yet rated
02/01/02
28 Lead Ceramic Dual-In-Line Package (CerDIP) 32-Lead Ceramic Windowed Dual-In-Line package (CerDIP)
http://www.cypress.com/?rID=36265
Qualification Reports
Not yet rated
01/01/02
28-Lead Windowed Cerpack (WCerPACK) Anam Philippines
http://www.cypress.com/?rID=36263
Qualification Reports
Not yet rated
01/01/02
68-Lead Ceramic Leadless Chip Carrier Package (LCC) Anam Philippines
http://www.cypress.com/?rID=36266
Qualification Reports
Not yet rated
01/01/02
84-Ball Ceramic Windowed Pin Grid Array (WPGA) Anam Philippines
http://www.cypress.com/?rID=36262
Qualification Reports
Not yet rated
01/01/02
High Performance CPLD
http://www.cypress.com/?rID=36088
Qualification Reports
Not yet rated
10/01/01
High-Performance CPLD
http://www.cypress.com/?rID=36101
Qualification Reports
Not yet rated
10/01/01
272 Plastic Ball Grid Array (PBGA) 27mm x 27mm MSL3 ASE Taiwan Assembly
http://www.cypress.com/?rID=35556
Qualification Reports
Not yet rated
09/01/01
Alloy-42 Lead Frame for 52-lead PQFP Package ASE Taiwan Assembly
http://www.cypress.com/?rID=35528
Qualification Reports
Not yet rated
09/01/01
MSL 3 208-Pin Enhanced Quad Flat Pack (EQFP) 28mm x 28mm ASE Taiwan Assembly
http://www.cypress.com/?rID=35531
Qualification Reports
Not yet rated
09/01/01
400-Ball Thin Ball Grid Array (FBGA) Level 3 21mm x 21mm x 1.4mm ASE Taiwan Assembly
http://www.cypress.com/?rID=35516
Qualification Reports
Not yet rated
08/01/01
36 Ld, 400 Mil SOJ Package, Cypress Philippines Assembly
http://www.cypress.com/?rID=36294
Qualification Reports
Not yet rated
05/01/01
388 Ld BGA Package, ASE Taiwan Assembly
http://www.cypress.com/?rID=36349
Qualification Reports
Not yet rated
05/01/01
64-pin Ceramic Quad Flat Pack (CQFP) Package, Alphatec, Bangkok
http://www.cypress.com/?rID=35483
Qualification Reports
Not yet rated
05/01/01
Fab 4 - 64K x 32 Synchronous Pipelined Cach RAM, R52D-3 Technology (CY7C1329)
http://www.cypress.com/?rID=36370
Qualification Reports
Not yet rated
05/01/01
New Technology, TSMC 0.25um, 8Meg, Sync SRAM, 3.3V, (GVT71256*/GVT71512*)
http://www.cypress.com/?rID=36394
Qualification Reports
Not yet rated
05/01/01
New Technology, WaferTech 0.35um, 4 Meg, Sync SRAM, 3.3V, (GVT71128B36Y/*E36Y/*G36Y/GVT71256B18Y/*D18Y/*E18Y/*F18Y/*G18Y)
http://www.cypress.com/?rID=36396
Qualification Reports
Not yet rated
05/01/01
TSMC - 4Meg Sync SRAM, 3.3V, TSMC 0.25um Technology, (GVT71128DA36W/*CA36W/*B36BW/*D36BW/GVT71256DA18W/*CA18W/*T18W)
http://www.cypress.com/?rID=36395
Qualification Reports
Not yet rated
05/01/01
TSMC - 8Meg, Sync SRAM, 3.3V, TSMC 0.25um Technology, (GVT71256ZB36Z/*ZC36Z/GVT75256ZC36Z/*ZC18Z/GVT71512ZB18Z/ZC18Z)
http://www.cypress.com/?rID=36390
Qualification Reports
Not yet rated
05/01/01
TSMC - New Technology TSMC 0.35um, 4Meg, Sync SRAM, 2.5V - 3.3V, (GVT7132*/GVT7164*/GVT71256*/GVT71512*)
http://www.cypress.com/?rID=36393
Qualification Reports
Not yet rated
05/01/01
WaferTech - 2Meg, Sync SRAM, 3.3V, WaferTech 0.35um Technology, (GVT7164B36Y/*S36Y/*T18Y/GVT71128B18Y/*D18Y)
http://www.cypress.com/?rID=36391
Qualification Reports
Not yet rated
05/01/01
WaferTech - 3Meg 128K x 24 Static RAM, WaferTech .35um Technology, (CY7C1024AV33)
http://www.cypress.com/?rID=35497
Qualification Reports Wafer & Die
Not yet rated
05/01/01
WaferTech - 4Meg, Sync SRAM, 3.3V, WaferTech 0.35um Technology,(GVT71128ZC36Y/*ZB36Y/GVT71256ZC18Y/*ZB18Y)
http://www.cypress.com/?rID=36392
Qualification Reports
Not yet rated
05/01/01
New Technology Wafertech 0.25um (CY7C132*/CY7C134*/CY7C135*)
http://www.cypress.com/?rID=35525
Qualification Reports
Not yet rated
04/01/01
Fab 4 - 64K x 18 Synchronous Cache RAM, R42HD Technology (CY7C1031/CY7C1032)
http://www.cypress.com/?rID=36386
Qualification Reports
Not yet rated
02/01/01
Hitachi CEL 9200CY IV77 Mold Compound for 28-lead SOJ and 28-lead Narrow SOIC Package, MSL 3, Cypress Philippines Assembly
http://www.cypress.com/?rID=35506
Qualification Reports
Not yet rated
02/01/01
Fab HME - 128K, 50MHz, Dual Port SRAM with PCI Bus Controller, 0.5um TLM Technology (CY7C09449PV-AC)
http://www.cypress.com/?rID=35480
Qualification Reports Dual-Port SRAMs, PCI Dual Ports
Not yet rated
01/01/01
Snap Cure Epoxy, 28-lead SOJ / SNC Package, Level 3, Cypress Philippines
http://www.cypress.com/?rID=35493
Qualification Reports
Not yet rated
01/01/01
TSMC-Fab 2B, High Performance CPLDs - 128 Macrocell, E3 Technology (CY37128P84,CY37128VP84)
http://www.cypress.com/?rID=35477
Qualification Reports Video (SMPTE) PHYs
Not yet rated
01/01/01
32.45-lead SOIC Package,NITTO MP8000CH, Molding Compound, Cypress Philippines Assembly
http://www.cypress.com/?rID=35495
Qualification Reports
Not yet rated
12/01/00
48 Lead Fine Pitch Ball Grid Array (FBGA) 7 mm x 8.5mm ASE Taiwan
http://www.cypress.com/?rID=36372
Qualification Reports
Not yet rated
12/01/00
Assembly Site Transfer for 160/208-pin Ceramic Quad Flatpacks (CQFP) Alphatec, Bangkok
http://www.cypress.com/?rID=35499
Qualification Reports
Not yet rated
12/01/00
28-Lead Ceramic Windowed J-Leaded Chip Carrier (WLCC) Anam Philippines
http://www.cypress.com/?rID=36264
Qualification Reports
Not yet rated
11/01/00
48-Ball Fine-Pitch Ball Grid Array (FBGA) 7x7mm FIC Taiwan
http://www.cypress.com/?rID=36388
Qualification Reports
Not yet rated
11/01/00
Fab 2 - Low Cost VMEbus Interface Controller Family, L28EPD Technology, (CY7C960A/CY7C961A)
http://www.cypress.com/?rID=36380
Qualification Reports
Not yet rated
11/01/00
Fab 2- Low Speed Microcontrollers, P26TLM, (CY7C63221/CY7C63231/CY7C63722/CY7C63723/CY7C63742/CY7C63743)
http://www.cypress.com/?rID=35484
Qualification Reports
Not yet rated
11/01/00
Fab 4 - Low Voltage Deep Sync FIFO, R42D Technology (CY7C425*/CY7C426*/CY7C427*/CY7C428*/CY7C429*)
http://www.cypress.com/?rID=36269
Qualification Reports FIFOs
Not yet rated
11/01/00
Results 34801 - 34900 of 35140 < Previous  349  350   351   352   353    ...  348   349  350   351   352   Next >

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